September 15, 2021

Master’s degree in Electrical / Communications Engineering or related field.
 7+ years of experience of industry leading RFIC design engineering.
 3+ years of RFIC team leadership experience.
Project Kuiper is an initiative to launch a constellation of Low Earth Orbit satellites that will provide low-latency, high-speed broadband connectivity to unserved and underserved communities around the world.
Come work at Amazon!
The Role:
As RFIC Design Engineering Manager, you will engage with an experienced cross-disciplinary staff to conceive and design innovative product solutions. You will work closely with an internal inter-disciplinary team, and third party suppliers to drive key aspects of product definition, execution and optimization. You must be responsive, flexible and able to succeed within an open collaborative peer environment.
As a member of the RFIC team, you will be responsible for the architectural definition, design, simulation, layout, and extracted simulation for transmit and receive front-ends from data converters to LNAs and PAs. Strong focus will be on creating power and cost optimized solutions for a given system performance.
In this role you will:
 Collaborate with communications systems, digital design, and chip implementation teams to explore and develop architectures for mm-wave and RF circuits like VCOs, mixers, phase shifters, LNAs, PAs, LO distribution, frequency multipliers and dividers, and envelope/power detectors.
 Drive interactions with suppliers such as foundries and OSATs to complete engineering programs for ATE, packaging, and back-end services.
 Establish and maintain methodologies for RFIC design, layout, and verification to ensure first-time success of new silicon designs.
 Perform circuit layout, RLC extraction, and run extracted simulation across various corners to make sure designs are robust and can be taken to volume production.
 Collaborate with the digital design team to define analog/digital boundary requirements for circuit calibration, clock generation, and timing.
 Collaborate with package and board designers to specify requirements and review schematics and layouts.
 Write SoWs for supplier contracts, and negotiate supplier contracts.
 Write and maintain RF specifications for chips, packages, and boards.
 Validate pre-production silicon to identify design changes needed to obtain required performance. Prioritize and implement design changes to satisfy program schedule and performance targets.
 Specify bench and production test plans for chips, and review measurement results.
Export Control Requirement:
Due to applicable export control laws and regulations, candidates must be a U.S. citizen or national, U.S. permanent resident (i.e., current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum.
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PhD degree in Electrical / Communications Engineering or related field.
 RF transceiver architecture / design for beamforming systems (including zero-IF transceivers, low-IF transceivers, polar transmitters, and RF/LO/Baseband phase shifting)
 Radio calibration methods for high-performance wireless systems (including for zero-IF transceivers, I/Q imbalance, LO feedthrough, digital pre-distortion or others.
 Radio subsystem design (including LNAs, PAs, ADCs, DACs, baseband filters, etc).
 RF CMOS circuit design in FinFET or SOI technologies.
 Analog circuit design fundamentals, such as opamps, precision biasing, and LDOs.
 Electromagnetics of passive devices, and device physics of leading edge silicon and III-V devices.
 Mixed-signal design and verification techniques.
 Communication Theory, OFDM, MIMO, Digital/Wireless Communication Systems and RF engineering.
 Supplier and OSAT Management and contract negotiation.
 Experience with current and upcoming RF standards in cellular (4G/5G NR), WiMAX, 802.11ad, microwave backhaul, or similar broadband wireless standards.